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Powering the Next Wave of Innovation

As the demand for power electronics accelerates, the need for more power in smaller, higher density packages has never been greater. Our advanced IGBT and Silicon Carbide (SiC) power modules deliver higher switching frequencies and improved thermal management – enabling high performance power conversion across rail traction, industrial drives, renewable energy, grid systems, off-highway vehicles, and AI data centers. Designed for ruggedness and reliability, our technologies help engineers optimize power density, reduce losses, and enhance long term system performance.

Visit us at APEC 2026, Booth 2256, and see our latest nHPD2 half bridge IGBT and SiC modules, along with our IHM units driving the next generation of power electronics and electrification.

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